Heterogene integratie op chips

Silicium-germanium MEMS

Invent - Imec is currently working on integrating MEMS with CMOS readout and driver electronics on one chip. This pure CMOS integration will result in much smaller packages with fewer interconnections than current hybrid systems, which combine MEMS and electronics on separate chips.

Fir this integration, a dedicated SiGe MEMS platform has been set up in imec's 200mm fab. This MEMS platform consists of several processing modules, such as the CMOS protection, the electrical connection to the CMOS metallization, the electrode and the sacrificial layer deposition and etch module. Next to that, functional modules (optical, electrical, probes ...) can be added depending on the functionality that is needed.

Achieve - One of the highlights of 2008: with this platform, imec has built a reliable 11 megapixel micro-mirror array for high-end industrial applications.