Events
ITF 2012 Taiwan
20/3/2012 09h00 - 21/3/2012 18h00 | No.188, Sec. 2, Zhonghua Rd., Hsinchu City, Taiwan R.O.C. (300)
Keep abreast of semiconductors-based innovation and a smarter connected world. Join Imec Technology Forum 2012 Taiwan.
Semiconductors and system design technologies are currently playing a game-changing role in our professional, private and social life with the massive breakthrough of smart phones, digital tablet pc's, intelligent naviagation systems,... A more affordable and efficient healthcare system is on its way. And there’s much more we can expect, as the technology supporting the Internet of Things will provide us with systems that become even smarter and more efficient and lower cost and power consumption. Read more
A wide range of technologies combining chips with many functions is the fundament of this evolution. Heterogeneous 3D integration combining MEMS, analog functions, sensors and actuators with high-performance CMOS chips is rapidly emerging. And ever more powerful CMOS chips will remain the core of all these emerging products. Tomorrow’s systems will require extreme computation and storage capabilities, orders of magnitude above what the processors and memories of today can deliver.
The Taiwan edition of the imec technology forum offers you an exciting mix of presentations on the future of semiconductor technologies, smart wireless communications and vision systems. You will get first hand insights in future developments, technological challenges and recent findings straight out of the labs. ITF2012 Taiwan is also an ideal networking place to discuss with industry leaders the necessary steps to remain at the forefront of semiconductors-based innovations.
Registration for ITF Taiwan, click here
Don’t miss this great event. Don’t miss the future. Be part of IT.
2012年imec科技論壇將為您提供未來半導體技術發展趨勢與創新研究成果。
我們的日常生活、工作與專業領域中,半導體技術和系統設計扮演著技術革新的角色,並大量運用於智慧型手機、平板電腦與導航系統。醫療照護系統將會更普及而有效率。未來我們可預期,網際網絡聯結科技服務將為我們生活帶來更高效率且節能的新領域。
整合多元技術與功能的晶片是這項創新的基礎。異質性整合三維堆疊(3D IC)技術結合微機電(MEMS),類比電路(analog functions),感應器(sensors)和制動器(actuators)相結合的高效能CMOS晶片正在市場快速崛起。功能更強大的CMOS晶片將成為這些新興產品的主要核心。未來的智能系統需要整合比現今強大數倍的微處理器及記憶體。
2012年IMEC在台灣舉行的科技論壇將為您提供未來技術發展趨勢及挑戰之因應,以及實驗室裡最新的研究結果。
Imec誠摯邀請您參與本次的盛會,並竭誠歡迎您的報名。






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