imec CMORE - from concept to product

Imec CMORE turns your innovative concepts into packaged microsystem products.

Imec CMORE services range from development-on-demand, over prototyping, to low-volume production. These services profit from the expertise in many research areas available at imec, such as our outstanding reliability expertise. CMORE solutions are implemented in imec’s cleanrooms including advanced packaging capabilities, such as 3D integration.

Imec CMORE services create innovative, integrated applications combining heterogeneous functionality. They do so by extending the CMOS technology with additional process steps. An example is integrating sensors or micromechanical systems (MEMS) with CMOS circuitry on one chip. 

The technologies we include in CMORE are:

  1. CMOS-based (130/90/65nm CMOS, complementary BiCMOS, high voltage, detectors, etc.)
  2. SiGe-based integrated CMOS MEMS technology (micromirrors, gyroscopes, new type of memories, biosensors, resonators, RF switches, cantilevers, etc.)
  3. CMOS-integrated sensor systems (CMOS gas sensors, cell-IC interfaces, biocompatible needles, electronic lenses, etc.)
  4. Thin-film based technologies (above-IC integrated passive devices, etc.)
  5. Silicon photonics - in collaboration with Ghent University (photonic integrated circuits based on submicron optical waveguides in silicon-on-insulator, wavelength filters, fiber interfaces, etc.)
  6. GaN on silicon (wafer and device technologies, etc.)
  7. Advanced packaging and integration technology (through-silicon-vias, multi-layer thin-film, MEMS capping, 3D interconnection, system and design expertise for digital, analog, RF, MEMS, etc.)

More information: imec CMORE brochure